SMT Pick And Place Machine With LED Tube

SMT pick and place machine with LED tube

Product Description

The smallest component that can be mounted on this placement machine is 0201, and the maximum range of recognizable components is 40*40mm. It supports customization and can be made to recognize larger machines.

Independent placement head vacuum detection function to detect leakage and automatic replenishment to improve machine stability.

The capacity under ideal conditions is 40000CPH.

Parameter

Composition of SMT solder paste

Solder paste = tin powder (METAL) + flux (FLUX).

Tin powder is usually produced by high-pressure nitrogen atomization or rotating disc method, and then screened by wire mesh. Flux is composed of binder (resin), solvent, active agent, thixotropic agent and other additives, which plays a vital role in the whole process of solder paste from printing to soldering. In general, the weight ratio of 10% flux and 90% tin powder (90% tin alloy powder), and the volume ratio of 50% flux paste and 50% tin powder. It is an indispensable soldering material in the SMT process and is widely used in the reflow soldering process.

Here's what each component does:

1. Alloy (tin powder): It mainly reflects the strength of welding, and has the function of conducting electricity and bonding.

2. Flux: It is a combination of tin powder and other additives, which plays a role in preventing tin collapse, can remove metal oxide film and dirt, and can cover the metal surface and isolate it from the air during high-temperature operations, so that oxidation cannot proceed. It acts like a protective film.

3. Solvent: Dissolve all the FLUX into a uniform solution, and then obtain a flux with uniform activity.

4. Activator: Eliminate oxides on the welding surface and reduce surface tension.

5. Thixotropic agent: viscosity control, improve printing ability, prevent collapse.

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