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SMT P&P Machine Apply To LED Lens

SMT P&P Machine Apply To LED Lens

Single module, a total of 12 nozzles, 28 feeder
Ideal production capacity 45000CPH

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Features

SMT P&P machine apply to LED lens

Product Description

Single module: HT-E8S-1200 SMT mounting machine has only one system control, and the relative price is relatively reasonable. It adopts windows7 system control, which is simple and easy to operate.

Magnetic levitation: HT-E8S-1200 adopts the combination of high-end magnetic levitation linear motor and servo motor in motor control, which prolongs service life and has higher precision

Multifunctional SMT pick and place machine: widely used, whether it is a home appliance application control panel or LED lights, especially LED lights are not limited to types

 

Parameter

System

Windows7

Software

R&D independently

Display

Touch screen monitor

Input Device

Keyboard, Mouse

No. of Camera

2 sets of imported camera

Vision for the flight identification, MARK correction

Mounting Precision

±0.04mm

Mounting Height

<15mm (Automatic Changing)

Mounting Speed

45000 CPH

Components

LED , capacitors, resistors, IC,shaped components, etc.

Components Space

0.2mm

No. of Feeders Station

28 PCS

No. of nozzles

12 PCS

Power

380AC 50HZ

Power Consumption

4 KW

Operating Environment

23℃±3℃

Conveyor transmission

Max length :1200 mm

Transmission Speed

＞1000mm/sec

Transmission Direction

Both direction (option)

Transmission Mode

Auto online drive

Air supply

0.4-0.6mpa (4-6kgf/cm2)150N/min

Electrical control

Independent research and development by ETON

X,Y,Z Axis Drive way

High-end magnetic linear motor + Servo motor

Feeding way

Electric feeder with double motor

 

 2 800500

 

 

 

Reasons for poor gloss of solder joints in SMT chip processing

1. The tin powder in the solder paste has oxidation appearance.

 

2. The flux itself in the solder paste has additives that form a matting effect.

 

3. The preheating temperature of reflow soldering is low in SMD processing, and there are residues that are not easy to evaporate on the surface of the solder joints.

 

4. After soldering, there are rosin or resin residues on the appearance of the solder joints. This is a phenomenon that is often seen in actual operations, especially when using rosin-type solder paste. The spot is slightly bright, but the presence of its residue often affects this effect, especially in larger solder joints or IC feet; if it can be cleaned after soldering, the solder joint gloss should be improved.

 

5. Since there is no standard for the brightness of solder joints, if the products after soldering without silver solder paste are compared with those after soldering with silver solder paste, there will definitely be some distance, which requires customers to choose solder paste. should clarify their solder joint requirements to the supplier.


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