Products
SMT Mounting Machine With Canlights Making
HT-E8D-1200 is a dual-module dual-system SMT pick and place machine.
HT-E8D-1200 SMT pick and place machine has 24 nozzles in total, 12 on one side, and 48 in total for Feida, which can be applied to all LED lights and PCB driver boards.
Features
SMT mounting machine with Canlights making
Product Description
HT-E8D-1200 is a dual-module dual-system SMT pick and place machine. Dual-system means that each system is controlled by an independent computer without interfering with each other. It can produce two PCB boards at the same time, or a single PCB board can be produced separately. .
HT-E8D-1200 SMT pick and place machine has 24 nozzles in total, 12 on one side, and 48 in total for Feida, which can be applied to all LED lights and PCB driver boards.
Parameter
Mounting Precision | ±0.04mm |
Mounting Height | <15mm (Automatic Changing) |
Mounting Speed | 90000 CPH |
Components | LED , capacitors, resistors, IC,shaped components, etc. |
Components Space | 0.2mm |
No. of Feeders Station | 48 PCS |
No. of nozzles | 24 PCS |
Power | 380AC 50HZ |
Power Consumption | 8 KW |
Operating Environment | 23℃±3℃ |
Conveyor transmission | Max length :1200 mm |
Transmission Speed | ＞1000mm/sec |
Transmission Direction | Both direction (option) |
Transmission Mode | Auto online drive |
Air supply | 0.4-0.6mpa (4-6kgf/cm2)300N/min |
Electrical control | Independent research and development by ETON |
Motion control card module 2 set | Independent research and development by ETON |
X,Y,Z Axis Drive way | High-end magnetic linear motor + Servo motor |
Feeding way | Electric feeder with double motor |
Defects of SMT Solder Balls and Analysis of Failure Effects and Causes
Solder balls are a common problem encountered in reflow soldering. Solder balls often appear on the sides of chip components or between fine pitch pins.
Solder beading is usually large enough to be seen with the naked eye, and due to its size, is more likely to dislodge from the flux residue, causing a short somewhere on the assembly.
Solder balls are mostly caused by the scattering of solder caused by rapid heating during the soldering process. In addition to the above-mentioned printing dislocation and sag, it is also related to the viscosity of the solder paste, the degree of oxidation of the solder paste, the thickness (particle size) of the solder particles, and the activity of the flux.
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