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SMT Placement Machine With DOB Bulb

SMT Placement Machine With DOB Bulb

The smallest SMD component is 0402, the highest placement height is 15mm, and it can be customized
The ideal placement speed is 40000CPH

Features

SMT placement machine with DOB bulb

PCB

SMT pick and place machine PCB size is 450*350mm, and the minimum size is 80*80mm, which can adapt to the production and placement of all LED lights, and can also produce drivers.

SMT line

Fully automatic and semi-automatic lines can be selected for wiring, and lines can also be combined with other machines to maximize production capacity.

motor

This SMT machine adopts the combination of high-end magnetic levitation linear motor and servo motor, which maximizes the accuracy, and at the same time, has a longer service life.

 

Parameter

PCB Thickness

0.1-6mm

PCB Clamping

Pneumatic

No. of Camera

2 PCS

Accurate image recognition
Vision alignment, MARK correction

Mounting Height

≦15mm

Mounting Speed

40000 CPH

Components Speed

0.2mm

 SMT pick and place machine

Preparation before SMT chip processing

In order to ensure the smooth production of SMT, some preparations need to be done before the official production. Next, we will analyze the preparations before SMT chip processing.

 

1. SMT workshop supervisor arranges workshop plan

The supervisor of the SMT chip processing production workshop needs to arrange the workshop plan reasonably according to the weekly and monthly plans of the PMC department, combined with the material supply, and assign it to the elongation and technicians of each line in the workshop.

 

2. Check and confirm the production data

 

According to the production plan issued by the team leader and technicians, make preparations in advance, check whether there is a stencil, whether the serial number is printed, and determine the BOM list, placement machine program, production process, etc. in advance.

 

3. Count production materials

 

According to the production plan issued by the workshop, the material staff will count the production materials and the ingredient list. After the inventory is completed, they will be sent to each line body, and the solder paste and red glue will be warmed in advance according to the process requirements.

 

4. Mounter pre-programmed

 

Combined with the weekly and monthly plans of the planning department, the equipment engineer prepares the program for the new product proofing products in advance.

 

5. Preparation material and stencil test

 

The operator prepares the materials for the next work order in advance according to the workshop plan, and tests the steel mesh frame setting and tension.

 

6. Mounter debugging

 

Before production, technicians need to transfer the program backed up in the computer into the placement machine, adjust the track thimble of the placement machine, and check whether there are springboards or other errors in the program. After confirmation, the material can be loaded. And adjust the use temperature of the reflow product, and adjust the track.

 

7. Full process inspection

 

Before production, the technician needs to check the printing quality of the solder paste and red glue of the printing operator, whether the material of the placement machine is good, and the FEEDER is placed according to the specifications. After all the SMT patch processing can start production.

 

The SMT chip processing factory should do the above preparations so that it will not affect the customer's production progress and its own production plan.


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