SMT Placement Machine For Longer LED Strip

SMT placement machine for longer LED strip

Product Description

T9-2S SMT pick and place machine, the current production capacity breaks the world record, 500000CPH under ideal conditions.

With a special production line configuration, two lines can be combined with one line, sharing one placement machine and reflow oven, because this SMT pick and place machine is a dual-module dual-system, and it is also possible to produce two PCB boards at the same time.

Parameter

In-depth analysis of Surface Mount Technology (SMT)

SMT is by far the most popular technology in the printed circuit board assembly (PCBA) industry. Since entering the market in the early 1970s, SMT has become a major trend in the modern electronics assembly industry, replacing wave solder assembly that had to rely on manual insertion. This process is considered to be the second revolution in electronic assembly technology. In other words, SMT has become a global trend for international PCBA, leading to a huge shift in the entire electronics industry.

In addition, SMT has pushed electronic components to chip type, miniaturization, thinning, light weight, high reliability and versatility, and has become a sign indicating the degree of scientific progress of a country.

Technology and properties of SMT

SMT is a PCB assembly technology through which SMD (Surface Mount Device) can be mounted on the surface of the PCB with some techniques, equipment and materials as well as soldering, cleaning and testing to complete the assembly.

•SMT technology

According to the welding method and assembly method, SMT technology can be divided into different types.

1). According to the soldering method, SMT technology can be divided into two categories: reflow soldering and wave soldering.

2). According to the assembly method, SMT technology can be divided into full surface assembly, single-sided hybrid assembly and double-sided hybrid assembly.

The factors that affect the soldering quality mainly include: PCB design, solder quality (Sn63/Pb37), flux quality, oxidation degree of soldered metal surface (component soldering termination, PCB soldering termination), printing, mounting and soldering (suitable temperature), etc. technology. curve), equipment and management.

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