SMT Mounting Machine With Lens Lights

SMT mounting machine with lens lights

Product Description

HT-E8S-1200 is a multifunctional single module SMT pick and place machine

Versatile means powerful and versatile.

The size of the PCB board of this placement machine is 1200*500mm, which is very large and can meet the production of most lamps, such as DOB bulb, LED tube, LED strip, 0.5m/1m/1m/1.2m are suitable.

Not only that, it can also mount home appliance application circuit boards, resistors, capacitors, ICs, special-shaped components, etc., the minimum patch size is 0402, and the maximum mounting height is 15mm.

If your product is a particularly long tube, we can also support customization, we have mature technology for this placement machine, which can meet your needs.

Feature

12 nozzles, 28 feeders, the optimal production capacity is 45000CPH under ideal conditions, and the speed advantage is obvious among the products of the same level

Non-stop refill function

Dual motor electronic feeder, more stable feeding and higher precision

What defects can X-ray detect in SMT process?

X-rays can inspect the internals of component soldering. It utilizes the penetrating power of X-rays to detect problems such as insufficient solder, poor soldering, and short-circuiting of solder joints.

When defects such as pores, slag inclusions, and incomplete soldering occur, bright spots or bright lines will be formed in the defect area. Visually, we can judge whether there is a defect in an area based on whether an area in the inspection image is brighter than the surrounding background area. From the point of view of image processing, we can judge whether an area is a defect according to the pixel gray value in the flaw detection image.

The most likely causes of voids are the solder paste and the components themselves. In the X-ray image, some "bubbles" can be seen in the solder joints.

If there is a gray "bridge" between the solder joints, we can basically judge that the solder is shorted.

If the amount of solder paste is abnormal or the SMT deviates, the components may be displaced. Based on the X-ray inspection images, the shadows of the pins and pads do not match, and we can see that the components are misplaced.

Welding defects can be judged according to the grayscale and the size of the solder joints.

Oxidation of PCB pads can lead to poor soldering. The image presented by X-ray inspection is that the solder joint is significantly larger than normal.

Insufficient solder paste or solder paste flowing into nearby vias during reflow. On X-ray images, the solder joints are smaller than normal.

Cold soldering is the incomplete fusion of SMT solder paste due to insufficient soldering temperature and time during reflow soldering. Usually not easy to spot, but X-ray inspection images clearly show the problem.

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