SMT Production Process
SMT production process
1. Program placement machine
According to the template BOM patch location diagram provided by the customer, the coordinates of the location of the patch components are programmed. Then the first piece is processed with the SMT processing data provided by the customer.
2. Print solder paste
Solder paste with steel mesh is printed on the PCB board to solder the electronic component SMD pad to prepare for the welding of components. The equipment used is a screen printing machine (printing machine), which is located at the front end of the SMT patch processing line.
3.SPI
Solder paste detector, detection of solder paste printing is a good product, there is no less tin, tin leakage, tin and other bad phenomena.
4. Patch
Install the electronic component SMD accurately to the fixed position of the PCB. The equipment used is the SMT machine, which is located behind the screen printing machine in the SMT production line.
The SMT machine is divided into high-speed machine and universal machine
High speed machine: Used to attach large pin spacing, small components
Universal machine: Stick pin spacing small (pin dense), large components.
5. Melt the solder paste over high heat
The solder paste is mainly melted by high temperature, and the electronic component SMD and PCB board are solidly welded together after cooling. The equipment used is a reflow furnace, which is located behind the SMT machine in the SMT production line.
6.AOI
Automatic optical detector to detect whether the welded components have bad welding, such as stele, displacement, air welding, etc.
7. Visual inspection
The key items of manual inspection: whether the PCBA version is the changed version; Whether the customer requires the components to use substitute materials or components of the manufacturer or brand; IC, diode, triode, tantalum capacitor, aluminum capacitor, switch and other directional components are oriented correctly; Defects after welding: short circuit, open circuit, false parts, false welding.
8. Packing
Separate the products that pass the test. The packaging materials commonly used are bubble bags, electrostatic cotton, and blister trays. There are two main packaging methods, one is to use bubble bag or electrostatic cotton into a roll shape, separate packaging, is currently the commonly used packaging; The second is to customize the blister disk according to the size of PCBA. Lay out the package on the blister tray, mainly PCBA board which is more sensitive to the needle and has vulnerable patch elements.
Contact David
Whatsapp/Wechat/Tel: +86 13827425982
E-mail: david@eton-mounter.com
