Future Technology Development Trend Of SMT Equipment Industry
Future technology development trend of SMT equipment industry
New technology revolution and cost pressure gave birth to automation, intelligent and flexible manufacturing, assembly, logistics, packaging, testing integration system MES. The main theme of SMT manufacturing industry is to improve the automation level of electronic industry, reduce labor cost, increase personal output and maintain competitiveness. High performance, ease of use, flexibility and environmental protection are the main development trend of SMT equipment
High precision and flexibility
The industry competition intensifies, the new product launch cycle is shortening day by day, the environmental protection requirements are more demanding; With the trend of lower cost and miniaturization, higher requirements are put forward for electronic manufacturing equipment. Electronic equipment is developing towards high precision, high speed and easy to use, more environmentally friendly and more flexible. Paste the title function head to achieve arbitrary automatic switch; Pasting head to achieve dispensing, printing, detection feedback, the stability of mounting accuracy will be higher, parts and substrate window compatibility flexibility will be stronger.
Bring the realization of high efficiency, low power, less space, low cost. The demand for high-speed multifunctional laminating machine with double advantages is gradually increasing. The production mode of multi-track and multi-workbench mounting can reach about 500000CPH.
Convergence trend of semiconductor packaging and SMT
Electronic products are becoming smaller in size, more diversified in function and more sophisticated in components. The integration of semiconductor packaging and surface mount technology has become a general trend. Semiconductor manufacturers have begun to apply high-speed surface mount technology, and surface mount production lines have integrated some applications of semiconductors, and the boundaries of traditional technology areas are becoming blurred. The convergence of technologies has also led to a number of products that have been recognized by the market. POP process technology and sandwich process have been widely used in high-end intelligent products. Most brand SMT machine companies provide flip chip equipment (direct application of wafer feeder), which provides a good solution for the integration of surface mount and semiconductor assembly
